更新于 1月3日

硬件開發(fā)工程師

面議
  • 合肥蜀山區(qū)
  • 5-10年
  • 本科
  • 全職
  • 招2人

職位描述

設計技術支持PCB設計
Description:
- Participate in in-house design and development of next generation products from concept to mass production.
- Be the technical contact at OEM site to support various engineering builds. Represent the EE team in a cross-functional team environment.
- Identifying EE related issues. Drive resolution of cross-functional issues including those related to HW architecture including but not limited to performance, power consumption, thermal behavior, and production related such as quality, failure analysis, manufacturing, and development related such as schematic design, PCB layout, and overall system integration.
- Optimize system power management for longer battery life and higher performance.
Requirement:
- Minimum of 5 years of work experience in the design and development of computer electronic design and production.
- Direct experience in high volume computers /communication devices /consumer electronics preferred.
- Must have a solid understanding of the system development process including concept creation, schematics and board development, as well as board and system bring up and debugging.
- Must have direct experience with one or more of the following technologies: low power design, high density power design, x86 power delivery design, ARM power delivery design, and their design issues.
- Software and scripting experience a plus.
- Prefer to have X86 or ARM platform product power management experience.
- Must have excellent communication skills in both English and Chinese.

工作地點

聯想創(chuàng)新科技園

職位發(fā)布者

唐元媛/人事經理

昨日活躍
立即溝通
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聯想(HKSE: 992)(ADR: LNVGY)是一家年收入700億美元的全球化科技公司,位列《財富》世界500強第159名,在世界各地共有75,000名員工,服務遍布全球180個市場數以百萬計的客戶。為實現“智能,為每一個可能”的公司愿景,我們在不斷夯實個人電腦全球市場冠軍地位的基礎上,更進軍基礎設施、手機、解決方案和服務等新的增長領域。憑借堅定執(zhí)行智能化轉型戰(zhàn)略和持續(xù)開發(fā)改變世界的創(chuàng)新與技術,我們正在為世界各地的億萬消費者打造一個更加包容、值得信賴和可持續(xù)發(fā)展的數字化未來。歡迎訪問聯想官方網站 https://www.lenovo.com,并關注“聯想集團”微博及微信公眾號等社交媒體官方賬號,獲取聯想最新動態(tài)。面向新一輪智能化變革的產業(yè)升級契機,聯想提出智能化變革戰(zhàn)略,圍繞智能物聯網(Smart IoT)、智能基礎架構(Smart Infrastructure)、行業(yè)智能(Smart Verticals)三個方向,立志成為行業(yè)智能化變革的引領者和賦能者。2020/2021財年,聯想進一步擴展和提升服務業(yè)務,以服務和解決方案為導向推動轉型的深入,力爭在未來十年內將服務和解決方案打造成聯想新的核心競爭力。目前,聯想核心業(yè)務由三大業(yè)務集團組成,分別為專注智能物聯網的IDG智能設備業(yè)務集團、專注智能基礎設施的ISG基礎設施方案業(yè)務集團及專注行業(yè)智能與服務的SSG方案服務業(yè)務集團。聯想集團致力于通過持續(xù)創(chuàng)新、卓越運營和全球布局,推進業(yè)務的可持續(xù)發(fā)展,實現基業(yè)長青。
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